The successful candidate will design and validate high-speed packages through EM simulation, signal/power integrity analysis, and correlation with lab test & measurement verification. In addition, you will develop and maintain AD - Ks across multiple EDA platforms, including rule decks, parameterized cells, technology files, and automated verification flows. Design, Modeling, and Verification. Perform high-speed package design for advanced heterogenous packages (e.g., Si. P, FC-BGA, 2.5 D/3 D, chiplets) for high-speed RF and Optoelectronics. Build and refine 3 D EM models of package structures (transmission lines, interconnect and EM passives, etc.). Run and interpret EM, SI, and PI simulations (S-parameters, TDR/ TDT, eye diagrams, crosstalk, impedance, PDN impedance). Define and validate routing topologies and stackups to meet timing, loss, crosstalk, and impedance requirements. Collaborate with silicon, board, and system teams to co-optimize package, die, and PCB for end-to-end performance. Correlate simulation results with lab measurements (VNA, TDR, high-speed scopes) for model validation and sign-off. ADK, EDA Flows, and Automation. Develop and maintain Assembly Design Kits (AD - Ks) for package design across multiple EDA tools and foundry/ OSAT technologies. Create and validate technology files, layer stacks, material properties, and design rule sets for package implementation. Develop DRC/ LVS/validity rule decks for package layouts and ensure consistency across tools and process nodes. Build parameterized cells (P - Cells) and reusable library components for common package elements (vias, bumps, pads, RD - Ls, etc.). Implement scripted flows (e.g., Python, AEL, SKILL, etc.) to automate design entry, simulation setup, and verification. Integrate version control, configuration management, and documentation for AD - Ks and EDA flows. You Have:PhD. degree in Electrical Engineering or Physics with minimum of 4 years of industry experience (or MSEE with 8 years)Expertise in 2.5 D/3 D EM component design, including interconnect, with simulation and analysis software (Cadence, Keysight ADS, 3 DS CST or ANSYS HFSS, etc.)Expertise in package design software (Cadence Allegro X APD, Siemens Xpedition, etc.)Experience with developing PD - Ks/ AD - Ks in EDA CAD tools (Cadence, Keysight, etc.) Knowledge of IC packaging materials & techniques, substrate design, and microelectronics assembly process flows. Experience with SI/ PI simulation and analysis software. Advanced knowledge of RF & Optoelectronics test & measurement equipment Nice to Have:Expertise in PCB technology, including schematic capture and layout design (Altium Designer, etc.)Experience with RF component design (filters, couplers, equalizers, transitions)