As a Photonic Packaging Design Integration Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (Si. Ph) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design. Focus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches. Essential Responsibilities: Drives Si. Ph advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems. Support new customer products with innovative design solutions and technology design rules. Drives design reviews with cross functional teams Drives cross function teams to resolve technical & yield concerns Develops engineers skills in packaging design constraints and considerations Develops complex analysis models to predict for manufacturability, cost, and quality. Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs. Drives discipline and qualification robustness through a consistent global design processes Drive CIP (Continuous improvement plans) to deliver organizational goals. Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs Other Responsibilities:Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications: MS 20, or PhD 15 or more years of experience Experience in bringing packaged products from development into production. Experience with HFSS, Zmax, Flotherm, or other design and modeling tools. Advanced packaging design and layout expertise Strong written and spoken English communication skills Preferred Qualifications: Materials science, thermal, mechanical, simulation background. Experience with failure analysis, design of experiments, & packaging process integration. Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem. Expert in chip package interaction for 2 D, 2.5 D, 3 D, 3.5 D Si. Ph advanced packaging. Experiment Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing. Expected Salary Range$131,900.00 - $241,500.00 The exact Salary will be determined based on qualifications, experience and location.