CMP Module Process Engineer IV - (E4)
Hillsboro
Friday, 22 May 2026
Must be a technical expert with 10 years’ experience in Chemical Mechanical Planarization (CMP) Process with a strong Wafer Fab background. Must have data analytics background for performing analysis to identify, troubleshoot, and solve complex CMP Process, Yield, and Integration related problems. Lead discussions with customers to understand their High Value Problems (HVP), propose and implement new Continuous Improvement Projects (CIP), capture learning to maximize service opportunities and implement the solutions to improve customer KPI's. Increases CSA value through defect / variability / COO reduction and PM /process Cpk / matching / Output optimization. Identifies opportunities for CSA renewal /upsell /penetration. Demonstrates & drives the adoption of new service technologies including Fab. Vantage Offerings at the customer site through Demos, on site evaluations and Joint Development Programs. Resolves complex tool issues utilizing analytics, equipment, and process knowledge and systematic Fab. Vantage troubleshooting methodologies for effective root cause diagnostics and issues resolution. Can Issue the report and present to customer which including explain the priority and provide the suggestion based on the compare BOM, EC, FSS data and FV 360 for two products. Mentor/ Lead junior level MPE's. Advanced integration knowledge. Domain knowledge of 4 or more processes on 2 or more technologies. Lead and contribute to CMP network of experts and Community of Practice. Qualifications: BS - Engineering 10 years of experience in Chemical Mechanical Planarization (CMP) Process. Wafer Fab / Equipment experience. Communicates complex ideas, anticipates potential objections, and persuades others, often at senior levels, to adopt a different point of view. Regarded as the technical expert in CMP Unit Process and Wafer Fab operations. Additional Information. Time Type:Full time. Employee Type:Assignee / Regular. Travel:Yes, 50% of the Time.