Mechanical Engineer - Construction

Lexington

Tuesday, 26 May 2026

Develop detailed engineering designs, technical project plans, specifications, drawings, and 3 D models aligned with client requirements and industry standards. Perform CFD simulations using tools such as Cadence (e.g., Fidelity/ Pointwise or similar) to analyze airflow, temperature distribution, pressure gradients, and cooling effectiveness within data center environments. Design and optimize HVAC systems including CRAH/ CRAC units, chillers, cooling towers, containment systems (hot/cold aisle), ductwork, and ventilation strategies. Conduct mechanical calculations including cooling load analysis, airflow distribution, pressure drop, pump head, and energy efficiency to support design decisions. Interpret CFD results to recommend design improvements for thermal management, redundancy, and energy optimization (PUE reduction). Apply standard engineering practices while adapting designs to meet complex data center performance requirements. Collaborate with multidisciplinary teams (Electrical, Structural, Architectural, and Controls) to integrate mechanical systems into coordinated design packages. Participate in and facilitate internal/external design reviews, ensuring deliverables meet QA/ QC standards and project milestones. Perform site visits and field verifications to validate design assumptions, troubleshoot issues, and support construction activities. Manage RFIs, submittals, and technical inquiries from contractors and vendors, ensuring accurate documentation and version control. Support commissioning efforts by validating system performance against CFD predictions and design intent. Qualifications Required Qualifications: Preferred Qualifications Professional Engineer (PE) license preferred or PE tracked. Experience with Navisworks, PIPE-FLO, or similar hydraulic modeling tools. Familiarity with data center standards (Uptime Institute, TIA-942). Experience with energy modeling and sustainability strategies for high-density environments. Exposure to liquid cooling technologies (direct-to-chip, immersion cooling) is a plus.

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