At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. In-person exchanges are invaluable to our work. We’re working onsite 4 days a week as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary. Die Prep / Printed Circuit Board Assembly The Principal Process Engineer is responsible for developing and transferring highly stable, cost-effective, and scalable microelectronic packaging (Printed Circuit Board Assembly and Wafer Level Packaging) processes into manufacturing. You will develop and support equipment and processes such as underfill dispense, pick and place, solder paste dispense, reflow, epoxy cure, clean, laser cutting, automated inspections, etc. This entails output monitoring, performing necessary experiments to establish robust processes and gaining a thorough understanding of capabilities and interactions with upstream and downstream processes including metrology needs. You will provide inputs to design teams and advance the state of the art in microelectronic assembly. Responsibilities may include the following and other duties may be assigned. Scouting and feasibility work, material selection, process and equipment selection, tooling / fixture and equipment installation and assessment of inputs, outputs and alignment to requirements. Develops manufacturing processes that are applicable to statistical process control and may develop those techniques including the measurement systems. Performs equipment qualifications (IQ), process validations (Process characterization, OQ and PQ), and gage R&R studies (TMV)Applies statistical methods and science-based decisions to design experiments and implement improvement. Perform necessary experiments to establish robust processes. Monitor, root cause and resolve process yield issues. Provides technical and sustaining engineering support in a manufacturing area. Troubleshoots and resolves equipment/process production issues. Generates and maintains documentation per quality system regulations. Ensures processes and procedures are in compliance with regulations. Required Knowledge and Experience: Requires a Baccalaureate degree and minimum of 7 years of relevant experience OR Master's degree with a minimum of 5 years relevant experience OR PhD with 3 years relevant experience. Nice to have:Advance degree in Mechanical engineering or Materials Science. Experience in developing a process from concept to transfer in manufacturing Experience working in a high-volume facility. Experience with DRM / DFSS, Lean Sigma, or Green/ Black Belt Lean Sigma certification. Knowledge of DOE, statistical analysis methods and data analysis tools (Minitab, JMP, etc.)Experience and understanding of SPC principles including process capability analysis and control charts. Experience or aptitude to program, run and troubleshoot automated assembly equipment, visual inspection and automated metrology tools including. Experience in laser applications, including laser selection, optics package selection and ideally in joining, cutting, and marking. For Baccalaureate degrees earned outside of the United States, a degree that satisfies the requirements of 8 C. F. R. § 214.2(h)(4)(iii)(A) is required. Physical Job Requirements. The above statements are intended to describe the general nature and level of work being performed by employees assigned to this position, but they are not an exhaustive list of all the required responsibilities and skills of this position.