You will help shape next-generation package, board, and system technologies by driving advanced simulation, experimental validation, and cross-functional optimization. Working closely with Silicon Design, Supply Chain, and Electrical Design teams, your contributions will directly influence reliability, performance, and manufacturability across programs—while also supporting long-term technology roadmaps and industry leadership. Specific responsibilities include:Develop and apply novel simulation and experimental methods to enable and optimize advanced hardware technologies. This includes scalable multiphysics models to predict system-level performance, reliability, and manufacturability (e.g., solder joint reliability, warpage, TIM behavior). Design and execute DO - Es/test vehicles and computational analyses to establish design guidelines and optimize material, geometry, and architecture. Evaluate tradeoffs across performance, reliability, and manufacturability using modeling and analysis. Collaborate with academia and industry partners; contribute to standards bodies, conferences, IP development, and peer-reviewed publications. Minimum Qualifications. MS or PhD in Mechanical Engineering, Civil Engineering, Solid Mechanics, or Materials Science . years of experience in numerical analysis (e.g., FEA, CFD, coupled field analysis) and advanced packaging technology development. Strong background in mechanical design, reliability, and simulation of complex packaging structures, with a deep understanding of component- and board-level failure modes (e.g., warpage, CTE mismatch, delamination, fatigue). Proficiency in advanced simulation tools such as ANSYS Mechanical, Multiphysics, and Flotherm, with a track record of validating models through experimental methods. Demonstrated expertise in reliability testing, lifetime prediction methodologies, and characterization of real-world use conditions. Preferred Qualifications. Experience with Systems Integration, 2.5 D/3 D advanced packaging, heterogeneous integration, and emerging microelectronics technologies. Knowledge of JEDEC or IPC standards related to reliability and thermal/mechanical testing. Strong cross-functional collaboration skills with experience working closely with design, manufacturing, and research teams.